Objective: Grind and polish the chip end face to a mirror finish, ensuring end face perpendicularity and no edge chipping.

Key Challenges: Silicon-based chips are brittle, small in size, and difficult to fix during sample preparation.

Material: Silicon-based chip

Equipment & Accessories

Equipment: Semipol high-precision grinding and polishing machine

Accessories: Thin-sheet sample mounting fixture

Consumables

Diamond lapping films (15μm, 9μm, 3μm, 0.5μm)

ZN-ZP polishing cloth

AO-W aluminum oxide polishing suspension

Features of Semipol Equipment

Semipol is a high-precision grinding and polishing device capable of accurate semi-automatic sample preparation for various materials. It offers a maximum grinding capacity of 10mm, a resolution of 1μm, and a stability accuracy of ±2μm.

Suitable for high-precision grinding and polishing of integrated circuits, semiconductor wafers, optical components & optical fibers, petrographic samples, precision metal parts, and other materials.

Equipped with multiple fixtures to handle grinding and polishing of samples of different shapes and sizes.

Preparation Scheme

💠 Grinding with diamond lapping films (particle sizes: 15μm → 9μm → 3μm → 0.5μm, gradual refinement).

💠 Polishing with ZN-ZP polishing cloth + AO-W aluminum oxide polishing suspension.

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