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Microelectronic Component Cross-Section Analysis | Revealing Hidden Structural Details

Reliability issues in microelectronic components are not always visible from the outside. Metallographic cross-sectioning is an essential technique for structural verification and failure analysis in microelectronics and SMT applications. Cross-sectional examination helps evaluate several critical features: Wire bonding:Inspect bond interfaces, wire deformation, and potential bonding defects. Die attachment:Compare die attachment consistency, solder layer thickness, wetting […]

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Annealed Inconel 718: Understanding the Initial Microstructure

For nickel-based superalloys such as Inconel 718, metallographic examination of the annealed condition provides an important reference for subsequent processing and heat treatment. Evaluating the initial microstructure helps assess grain uniformity, abnormal grain growth, inclusions, and potential metallurgical defects. Reliable sample preparation is essential for obtaining a suitable surface for microstructural examination and supporting consistent […]

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EBSD Sample Preparation for SLM 3D-Printed Cu-Ni Alloys

Selective laser melting (SLM) offers significant potential for producing Cu-Ni alloys for marine equipment and heat-exchange components, thanks to their corrosion resistance and thermal conductivity. However, the relatively soft, ductile material and potential microcracks along melt pool boundaries make high-quality EBSD sample preparation challenging. Surface deformation, residual stress, and charging during SEM examination can compromise […]

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H59 Brass: Revealing the α/β Microstructure Through Metallographic Preparation

H59 brass is a copper-zinc alloy with a dual-phase microstructure. Reliable metallographic preparation is essential for clearly revealing the distribution and morphology of the α and β phases. For this sample, TROJAN’s preparation workflow combines controlled sectioning, progressive grinding, and fine polishing to help minimize surface damage and achieve consistent results. Preparation workflow: Cutting:Beta-250 Automatic […]

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TPCA Show 2026 (Taiwan)

Date: October 20-22, 2026 Venue: TaiNEX 1 Booth No.: J-628 From October 20 to 22, TPCA Show 2026 was held at TaiNEX 1 in Taipei. Trojan showcased a range of advanced inspection and testing equipment, as well as metallographic consumables, at Booth J-628, exploring ways to enhance process quality in the AI era with global PCB industry chain […]

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Silicon–Carbon Anode Materials: Preserving the True Microstructure

Silicon–carbon composites are promising anode materials for next-generation lithium-ion batteries. However, their porous structure and the coexistence of soft and hard phases make metallographic preparation challenging. Particle pull-out, pore-related artifacts, surface deformation, and edge damage can compromise microstructural evaluation. A carefully controlled preparation process is essential to preserve the material’s original features.   Preparation route: […]