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EP 1001 is typically used for bonding cover glass to small or delicate specimens (e.g., IC devices), adhering multiple specimens for TEM stacking, pre-coating specimens prior to encapsulation, and filling PCB micro-holes as well as other mounting applications.
EP 1001 can be applied using a brush or pipette. It provides excellent adhesion to a wide range of materials, including metals, ceramics, glass, and most plastics.
Product Features:
1. A (resin) / B (hardener) mixed at a volume ratio of 10:1 cures bubble-free in 5 minutes at 150°C.
2. Once cured, it resists most chemical etchants.
3. Turns red upon curing.
Ordering Information:
| Order No. | Description | Package |
| 02.04.903 | Epoxy Resin, Liquid | 10g |
| 02.04.904 | Epoxy Hardener, Liquid | 1g |
| 02.04.905 | Epoxy Resin, Liquid | 100g |
| 02.04.906 | Epoxy Hardener, Liquid | 10g |
Based in China, TROJAN pays attention to the international market, and has sold metallographic equipment to more than 50 countries, such as Europe, America, Japan and South Korea, Southeast Asia countries and regions
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