EP 1001 Epoxy Adhesive (10:1)

Cold Mounting Consumables

EP 1001 Epoxy Adhesive (10:1) Manufacturers

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EP 1001 Epoxy Adhesive (10:1)

EP 1001 is a rigid, fast-curing, two-component epoxy adhesive.

Product Features:

1. A (resin) / B (hardener) mixed at a volume ratio of 10:1 cures bubble-free in 5 minutes at 150°C.

2. Once cured, it resists most chemical etchants.

3. Turns red upon curing.

Applications:

EP 1001 is commonly used for small or precision samples (e.g., IC devices), adhering multiple samples for TEM stacking, pre-coating samples before encapsulation, and filling PCB microvias. It exhibits excellent adhesion to various materials, including metals, ceramics, glass, and most plastics.

Ordering Information:

Order No. Description Package
02.04.903 Epoxy Resin, Liquid 10g
02.04.904 Epoxy Hardener, Liquid 1g
02.04.905 Epoxy Resin, Liquid 100g
02.04.906 Epoxy Hardener, Liquid 10g

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