Objective: Grind and polish the chip end face to a mirror finish, ensuring end face perpendicularity and no edge chipping.
Key Challenges: Silicon-based chips are brittle, small in size, and difficult to fix during sample preparation.
Material: Silicon-based chip
Equipment & Accessories
Equipment: Semipol high-precision grinding and polishing machine
Accessories: Thin-sheet sample mounting fixture
Consumables
Diamond lapping films (15μm, 9μm, 3μm, 0.5μm)
ZN-ZP polishing cloth
AO-W aluminum oxide polishing suspension
Features of Semipol Equipment
Semipol is a high-precision grinding and polishing device capable of accurate semi-automatic sample preparation for various materials. It offers a maximum grinding capacity of 10mm, a resolution of 1μm, and a stability accuracy of ±2μm.
Suitable for high-precision grinding and polishing of integrated circuits, semiconductor wafers, optical components & optical fibers, petrographic samples, precision metal parts, and other materials.
Equipped with multiple fixtures to handle grinding and polishing of samples of different shapes and sizes.
Preparation Scheme
💠 Grinding with diamond lapping films (particle sizes: 15μm → 9μm → 3μm → 0.5μm, gradual refinement).
💠 Polishing with ZN-ZP polishing cloth + AO-W aluminum oxide polishing suspension.
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