EP 1001 is typically used for bonding cover glass to small or delicate specimens (e.g., IC devices), adhering multiple specimens for TEM stacking, pre-coating specimens prior to encapsulation, and filling PCB micro-holes as well as other mounting applications. EP 1001 can be applied using a brush or pipette. It provides excellent adhesion to a wide range of materials, including metals, ceramics, glass, and most plastics.