ENEPIG (Electroless Nickel-Palladium-Gold) stands as a dominant surface finish for high-performance PCBs. Built with compact, uniform Ni-Pd-Au triple-layer coating, it features superb oxidation & corrosion resistance plus low contact resistance.

It eliminates black pad issues from conventional immersion gold while supporting both soldering and wire bonding for complex electronic assembly.

Key Applications

✅ Semiconductor packaging substrates: ideal for Cu/Au wire bonding ✅ Automotive ECU & vehicle radar: anti-shock & resistant to wide temperature/oil pollution

✅ Medical precision equipment & aerospace PCBs: stable under extreme working conditions

✅ 5G base stations, high-frequency components & HDI circuit boards: massive volume adoption

Thanks to outstanding durability and process compatibility, ENEPIG is the vital finishing for reliable precision interconnection on premium electronics.

Metallographic Specimen Prep Parameters for ENEPIG PCB

1️⃣ Grinding: MET-SP P400~P4000

2️⃣ Fine Polishing: SC cloth + 1μm PD-WT

3️⃣ Final Polishing: ZN cloth + 50nm SO-439

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